Technology

Decisive for the reliability and the costs of a PCB are technology - base material - layout design. A combination that always influences each other - and is always within your sphere of influence.
If you consider technology and base material in advance, you not only layout cleverly, but also reduce the number of revisions considerably. Ask us, we will be happy to help you.

  • Rigid, Flexible & Rigid-Flexible - Printed Circuit Boards
  • HDI & HF printed circuit boards - structures from 50 µm
  • IMS PCBs - cores aluminium or copper
  • Number of layers standard up to 24 & more layers
  • Multilayer systems - one prepreg & 50ym cores
  • Sequential multiple pressings
  • Micro Via & Copper Fill
  • Blind-, buried-, staggered via & back drilling
  • Aspect Ratio PTH 1:10 & Blind Via Hole 1:1
  • Nominal hole Ø 0.10 mm to 6.20 mm
  • Closing & Plugging of Via Holes Type III-a & Type VII
  • Material End Thicknesses 0.05 - 5.0 mm
  • End Thickness Copper 12 - 210 µm & 400 µm
  • Impedance Tolerance -/+ 5 bis 10%
  • IPC Class 2 & 3

 

Surfaces

End surfaces - metallic and non-metallic for soldering and contact surfaces

Metallic

  • chemical Gold - ENIG - 4-6 µm Ni. / 0.05-0.1 µm Au
    RoHS, BGAs, Alu-wire bonding & restricted suitable for press-fit technology*

  • chemical ENIG thick gold - 4-6 µm / 0.5-1.0 µm
    RoHS, Gold- & Alu-wire bonding, restricted suitable for press-fit technology*

  • electroless nickel palladium gold - ENIGP 3 - 8 µm Ni. / 0.05 - 0.15 µm Au
    RoHS, BGAs, restricted suitable Press-fit technology*

  • HAL lead-free >1 µm - 40 µm
    RoHS, press-fit technology

  • chemical tin - >1 µm
    RoHS, BGAs, press-fit technology

  • chemical silver - >1 µm
    RoHS, BGAs, press-fit technology

  • electroplated hard gold 4 - 6 µm Ni. / 1.0 - 1.2 µm Au
    PC connector gold, conductive pattern requires electrical connection
    (cost-intensive process)
    restricted suitable for press-fit technology*

* Only restricted suitable for press-fit technology due to the brittleness of nickel.
For more information on press-fit technology, see www.zveig.org

Non-metallic

  • OSP - Organic Solderability Preservative 0.1 µm - 0.5 µm
    Organic surface protection, colourless
    high flatness and wettability, soldered directly onto copper
    good environmental compatibility & cost effective process

Non-metallic partial

  • Carbon print (conductivity carbon)
    Resist 40 Ohm +/- 5%

 

Soldermask - peel-off mask & placement print

Soldermask

  • Colour green matt - standard
    also red, black,
    White for LED technology
 

Peel-off mask

  • Colour blue - standard
    Function - Protection in the soldering process and for surfaces such as carbon & gold, covering hole Ø < 2.5 mm.

Placement print

  • White - Standard
    also yellow, black